The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Oct. 31, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John J. Ellis-Monaghan, Grand Isle, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Mark D. Jaffe, Shelburne, VT (US);

William J. Murphy, North Ferrisburgh, VT (US);

Kirk D. Peterson, Jericho, VT (US);

Steven M. Shank, Jericho, VT (US);

Assignee:

GLOBALFOUNDRIES U.S. 2 LLC, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 31/20 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 31/208 (2013.01);
Abstract

An encapsulated sensors and methods of manufacture are disclosed herein. The method includes forming an amorphous or polycrystalline material in contact with a layer of seed material. The method further includes forming an expansion space for the amorphous or polycrystalline material. The method further includes forming an encapsulation structure about the amorphous or polycrystalline material. The method further includes crystallizing the amorphous or polycrystalline material by a thermal anneal process such that the amorphous or polycrystalline material expands within the expansion space.


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