IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9171969 B1

PDFFull Text
Date of Patent:
Oct. 27, 2015

Filed:

Jan. 23, 2014

Mounting member having die pad unit and terminals, and photocoupler having the mounting member

Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Mami Yamamoto, Oita-ken, JP;

Yoshio Noguchi, Hyogo-ken, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-Ku, Tokyo, JP;

Attorney:

White & Case LLP

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 29/16 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); G02B 27/00 (2006.01); G02B 6/26 (2006.01); G02B 6/42 (2006.01); H01L 31/02 (2006.01); H01L 31/173 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02005 (2013.01); H01L 31/173 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.

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