The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Feb. 11, 2013
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Osamu Oka, Kumamoto, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02 (2013.01); H01L 23/562 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 23/585 (2013.01); H01L 25/50 (2013.01); H01L 2924/0002 (2013.01);
Abstract

There is provided a solid-state imaging device including a wafer in which a guard ring with conductivity in an insulation film layered on a first conductivity type substrate is formed between an edge portion of at least a first chip, out of the first chip and a second chip of a layered chip, and a scribe line region, at least two second conductivity type layers are formed at an interval within a region corresponding to the guard ring, in the first conductivity type substrate, and the guard ring includes a first guard ring part connected to one of the second conductivity type layers on a chip edge portion side, and a second guard ring part connected to another one of the second conductivity type layers on a scribe line side.


Find Patent Forward Citations

Loading…