The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Nov. 15, 2011
Applicants:

Robert D. Horning, Savage, MN (US);

Ryan Supino, Loretto, MN (US);

Inventors:

Robert D. Horning, Savage, MN (US);

Ryan Supino, Loretto, MN (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/84 (2013.01); B81B 7/0032 (2013.01); B81B 7/0038 (2013.01); B81B 7/0074 (2013.01); B81B 7/0077 (2013.01); B81B 2201/025 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81C 2201/019 (2013.01);
Abstract

Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.


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