The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Oct. 13, 2011
Applicants:

David L. Snyder, Beaverton, OR (US);

Sudarsan Uppili, Portland, OR (US);

Guillaume Bouche, Beaverton, OR (US);

Inventors:

David L. Snyder, Beaverton, OR (US);

Sudarsan Uppili, Portland, OR (US);

Guillaume Bouche, Beaverton, OR (US);

Assignee:

Maxim Integrated Products, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 29/402 (2013.01); H01L 21/82385 (2013.01);
Abstract

Semiconductor devices, such as LDMOS devices, are described that include an interlayer-dielectric layer (ILD) region having a thickness of at least two and one half (2.5) microns to increase the maximum breakdown voltage. In one or more implementations, the semiconductor devices include a substrate having a source region and a drain region formed proximate to a surface of the substrate. A gate is positioned over the surface and between the source region and the drain region. An ILD region having a thickness of at least two and one half (2.5) microns is formed over the surface and the gate of the device. The device also includes one or more field plates configured to shape an electrical field generated between the source region and the drain region when a voltage is applied to the gate.


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