The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Dec. 03, 2013
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 3/00 (2006.01); H01L 27/06 (2006.01); H01L 23/495 (2006.01); H03K 17/567 (2006.01); H01L 23/482 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 23/4824 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H03K 17/567 (2013.01); H01L 25/072 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/30107 (2013.01);
Abstract
A cascode circuit arrangement has a low voltage MOSFET and a depletion mode power device mounted on a substrate (for example a ceramic substrate), which can then be placed in a semiconductor package. This enables inductances to be reduced, and can enable a three terminal packages to be used if desired.