The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jan. 06, 2014
Jin-ho Lee, Gwacheon-si, KR;
Hee-seok Lee, Yongin-si, KR;
Se-ho You, Seoul, KR;
Jeong-oh Ha, Hwaseong-si, KR;
Jin-Ho Lee, Gwacheon-si, KR;
Hee-Seok Lee, Yongin-si, KR;
Se-Ho You, Seoul, KR;
Jeong-Oh Ha, Hwaseong-si, KR;
Abstract
A stack type semiconductor package includes a lower semiconductor package including a lower package substrate and at least one lower semiconductor chip disposed on the lower package substrate; an upper semiconductor package including an upper package substrate larger than the lower package substrate and at least one upper semiconductor chip disposed on the upper package substrate; an inter-package connector connecting an upper surface of the lower package substrate to a lower surface of the upper package substrate; and a filler filling in between the lower package substrate and the upper package substrate while substantially surrounding the inter-package connector.