Method of sealing and contacting substrates using laser light and electronics module

Abstract

The invention concerns a method of fusing and electrically contacting a first insulating substrate (A) having at least one first conductive layer (A) thereon with at least one second insulating substrate (B) having at least one second conductive layer (B) thereon, the method comprising: stacking the first and second substrates (A,B) such that an interface zone is formed between them, the interface zone comprising an electrical contacting zone where at least one first conductive layers (A) faces and is at least partially aligned with at least one second conductive layer (B), and a substrate fusing zone where the insulating substrates (A,B) directly face each other; focusing to the interface zone of the substrates (A,B) through one of the substrates (A,B) a plurality of sequential focused laser pulses from a laser source, the pulse duration, pulse frequency and pulse power of the laser light being chosen to provide local melting the substrate (A,B) materials and the conductive layers (A,B); and moving the laser source and the substrate with respect to each other at a predetermined velocity and path so that a structurally modified zone is formed to the interface zone, the structurally modified zone overlapping with said electrical contacting zone and said substrate fusing zone. The invention provides a convenient way of manufacturing well-sealed joints and electrical contacts for multifunction electronic devices, for example.