The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Dec. 03, 2013
Applicants:
Kil Yong Lee, Uiwang-si, KR;
Jae Sun Han, Uiwang-si, KR;
Jong Hyuk Eun, Uiwang-si, KR;
Inventors:
Assignee:
CHEIL INDUSTRIES, INC., Gumi-si, Gyeongsangbuk-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H05K 3/36 (2006.01); G02F 1/1345 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); G02F 1/13452 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H05K 3/361 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29363 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29416 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29486 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/15788 (2013.01); H05K 3/323 (2013.01);
Abstract
A method of manufacturing a semiconductor device includes attaching a curable film to a first connection member including a first circuit terminal, attaching a conductive film to a second connection member including a second circuit terminal, and thermally compressing the first connection member to the second connection member, with the first connection member and the second connection member placed such that the curable film and the conductive film face each other.