The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jul. 02, 2014
Soon Kang Chan, Petaling Jaya, MY;
Soo Choong Chee, Shah Alam, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Dominic Koey, Kuala Lumpur, MY;
Soon Kang Chan, Petaling Jaya, MY;
Soo Choong Chee, Shah Alam, MY;
Stanley Job Doraisamy, Kuala Lumpur, MY;
Dominic Koey, Kuala Lumpur, MY;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
An integrated circuit (IC) die has an active side and an inactive side, opposite the active side. A recess is formed within the interior of the inactive side and extends partially through the integrated circuit towards the active side. The IC die is part of a packaged IC device, where the die is attached to a package component such as a lead frame, substrate, or another die, using die attach adhesive that fills the recess, thereby providing a more reliable bond between the IC die and the package component.