The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
May. 07, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Masaomi Miyazawa, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/46 (2006.01); H01L 23/473 (2006.01); H01L 23/34 (2006.01); H01L 23/467 (2006.01); H01L 23/36 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/46 (2013.01); H01L 23/3675 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/4735 (2013.01);
Abstract
A semiconductor cooling device includes: a cooling medium flow channel, through which a cooling medium for cooling a semiconductor chip flows; a laminar flow section which is provided in a region upstream of the cooling medium flow channel and allows the cooling medium to flow in the form of laminar flow; and a turbulent flow section which is provided in a region downstream of the laminar flow section in the cooling medium flow channel and allows the cooling medium, which flows in the form of laminar flow from the laminar flow section, to flow in the form of turbulent flow.