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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9171761 B1

PDFFull Text
Date of Patent:
Oct. 27, 2015

Filed:

Feb. 27, 2014

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Takeshi Sasaki, Gunma, JP;

Masahiro Shindo, Tochigi, JP;

Kazumi Onda, Saitama, JP;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

Noon Intellectual Property Law, P.C.

Primary Examiner:

Ajay K Arora

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/82 (2006.01); B23K 20/00 (2006.01); B23K 20/10 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82 (2013.01); B23K 20/005 (2013.01); B23K 20/106 (2013.01); H01L 21/565 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/49589 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); B23K 2201/42 (2013.01); H01L 24/45 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48724 (2013.01); H01L 2224/48799 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49051 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/85099 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01);
Abstract

The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed. Even when a portion of the outer frame remains on the side surface of the resin package, connection between the connection lead etc and other hanging lead etc are prevented by providing a notch etc in the outer frame between the connection lead etc and the hanging lead etc.

Find Patent Forward Citations

Sasaki, Takeshi. (2015). Resin sealing type semiconductor device and method of manufacturing the same, and lead frame (U.S. Patent No. 9171761). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9171761

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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