The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Oct. 25, 2012
Applicant:

Newsouth Innovations Pty Limited, UNSW Sydney, AU;

Inventors:

Brett Jason Hallam, Bexley, AU;

Catherine Emily Chan, Randwick, AU;

Stuart Ross Wenham, Cronulla, AU;

Adeline Sugianto, Malabar, AU;

Pei Hsuan Lu, Rockdale, AU;

Valantis Vais, Beverley Park, AU;

Assignee:

NewSouth Innovations Pty Limited, UNSW Sydney, NSW, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/24 (2006.01); H01L 21/40 (2006.01); H01L 21/225 (2006.01); H01L 21/268 (2006.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/068 (2012.01); H01L 21/22 (2006.01); H01L 21/263 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2254 (2013.01); H01L 21/2225 (2013.01); H01L 21/268 (2013.01); H01L 21/2636 (2013.01); H01L 31/022425 (2013.01); H01L 31/068 (2013.01); H01L 31/1804 (2013.01); H01L 31/1864 (2013.01); Y02E 10/547 (2013.01);
Abstract

A method for creating an inwardly extending impurity distribution profile in a substrate comprising crystalline silicon material having a background doping of a first impurity type, comprising: a) providing one or more additional impurity sources with at least two different types of impurity atoms within the substrate or in proximity to the surface of the substrate, with each of these impurity atoms having different diffusion coefficients or segregation coefficients; b) locally melting a point on the surface of the substrate with a laser, whereby the at least two different types of impurity atoms are incorporated into the melted silicon material; c) removing the laser to allow the silicon material to recrystallize; d) controlling a rate of application and/or removal of the laser to control the creation of the impurity distribution profile, with different distribution profiles for each of the at least two types of impurity atoms in the recrystallized material.


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