The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Aug. 01, 2011
Applicant:

Takashi Muro, Makinohara, JP;

Inventor:

Takashi Muro, Makinohara, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/77 (2011.01); H01R 12/72 (2011.01); H01R 13/60 (2006.01); H01B 1/00 (2006.01); H01R 12/70 (2011.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
H01B 1/00 (2013.01); H01R 12/707 (2013.01); H01R 12/724 (2013.01); H01R 12/77 (2013.01); H01R 13/03 (2013.01); H01R 13/60 (2013.01);
Abstract

An object is to provide a fixture for a component to be mounted on a circuit board which is easily manufactured and can exhibit good solderability and high whisker resistance. In a fixture which includes a solder joint plate partthat can be fixed on a surface of a circuit board by soldering using solder cream, and a component fixing partthat can be fixed to a component configured to be mounted on the circuit board, and in which Sn plating is performed at least on a solder joint surface of the solder joint plate part, the solder joint plate partis divided into a plurality of long-plate-like solder joint pieces, and on both sides of each of the long-plate-like solder joint pieces, wing-like joint feet are provided to protrude through bent flexible parts, and the lower surface of each of the joint feetbecomes a solder joint surfaceto be joined with the surface of the circuit board by solder cream.


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