The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

May. 20, 2013
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Yuan-Chieh Lin, Lake Forest, CA (US);

Jun-Bin Huang, Eastvale, CA (US);

Terrance F. Little, Fullerton, CA (US);

Gang Paul Chen, Walnut, CA (US);

Jie Zheng, Rowland-Heights, CA (US);

An-Jen Yang, Irvine, CA (US);

Jim Zhao, Irvine, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4272 (2013.01); G02B 6/4284 (2013.01); G02B 6/4292 (2013.01); G02B 6/43 (2013.01);
Abstract

An AOC assembly comprising two printed circuit boards (PCB) (), a board holder () and two heat conducting covers () with integrated head spreader. Each of the two PC boards has a lower edge () extending in a longitudinal direction with circuit pads on opposite sides of PCB thereof. The board holder has two opposite vertical datum faces with two of said PC boards respectively positioned thereon. The two heat conducting covers oppositely fixed to the holder in a transverse direction perpendicular to the PC boards. When assembled, the integrated heat spreader of heat conducting shell would dissipate heat from the active electronic components on the PCB.


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