The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Apr. 02, 2012
Applicants:

Douglas Ngai, Diamond Bar, CA (US);

Joo Yong Tay, Singapore, SG;

Wen-feng Liu, Naperville, IL (US);

Roberto P. Loera, Chicago, IL (US);

Steven Dwade Cook, Vega, TX (US);

Inventors:

Douglas Ngai, Diamond Bar, CA (US);

Joo Yong Tay, Singapore, SG;

Wen-Feng Liu, Naperville, IL (US);

Roberto P. Loera, Chicago, IL (US);

Steven Dwade Cook, Vega, TX (US);

Assignee:

ILLINOIS TOOL WORKS INC., Glenview, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/012 (2006.01); F27B 9/30 (2006.01); B23K 1/008 (2006.01); F27B 9/32 (2006.01); F27B 9/34 (2006.01); F27D 1/16 (2006.01); F27D 17/00 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
F27B 9/3077 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/012 (2013.01); B23K 1/203 (2013.01); F27B 9/32 (2013.01); F27B 9/34 (2013.01); F27D 1/1678 (2013.01); F27D 17/008 (2013.01); B23K 2201/42 (2013.01); H05K 3/3494 (2013.01); Y10T 156/10 (2015.01);
Abstract

A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.


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