The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Jul. 20, 2011
Applicant:

Masanori Sakane, Ohtake, JP;

Inventor:

Masanori Sakane, Ohtake, JP;

Assignee:

DAICEL CORPORATION, Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08K 5/51 (2006.01); C08K 5/524 (2006.01); C08G 59/24 (2006.01); C09D 163/00 (2006.01); C08G 59/68 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/24 (2013.01); C08G 59/68 (2013.01); C08L 63/00 (2013.01); H01L 23/293 (2013.01); C08K 5/51 (2013.01);
Abstract

Disclosed is a liquid thermosetting epoxy resin composition including a base resin, a curing agent (D), and curing accelerator (E) or including a base resin and a curing catalyst (D'), each base resin including an alicyclic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a polyester polyol and/or a polycarbonate polyol (B), each polyol having two or more terminal hydroxyl groups; and a phosphorous ester (C). The liquid thermosetting epoxy resin composition exhibits excellent viscosity stability and can give a cured article which is homogeneous even when having a large thickness, does not crack under heat cycle conditions, and is highly thermally stable and satisfactorily optically transparent.


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