The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Apr. 18, 2011
Applicants:

Nobuhiko Matsumoto, Kanagawa, JP;

Eiichi Honda, Kanagawa, JP;

Kana Kumamoto, Kanagawa, JP;

Inventors:

Nobuhiko Matsumoto, Kanagawa, JP;

Eiichi Honda, Kanagawa, JP;

Kana Kumamoto, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 23/00 (2006.01); C08G 59/56 (2006.01); C08G 59/40 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/56 (2013.01); C08G 59/4014 (2013.01); C09J 163/00 (2013.01); Y10T 428/31515 (2015.04);
Abstract

Provided are an epoxy resin curing agent having excellent properties and high gas barrier capability that epoxy resin has and, in addition thereto, capable of realizing good adhesiveness to polyester and aluminum; an epoxy resin composition containing the curing agent; an adhesive for lamination including the composition as the main ingredient thereof; and a laminate film, a multilayer wrapping material and a wrapping bag using the adhesive. The epoxy resin curing agent comprises a reaction product of the following (A), (B) and (C): (A) meta-xylylenediamine or para-xylylenediamine, (B) a polyfunctional compound having one acyl group and capable of forming an amide group moiety through reaction with a polyamine and forming an oligomer, (C) a metal (meth)acrylate salt with a divalent or more polyvalent metal.


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