The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Dec. 18, 2008
Applicants:
Chien-jen Chung, Suzhou, CN;
Zhuo Wang, Suzhou, CN;
Inventors:
Chien-Jen Chung, Suzhou, CN;
Zhuo Wang, Suzhou, CN;
Assignee:
Ventec Electronics (Suzhou) Company, Jiangsu, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/30 (2006.01); B32B 15/14 (2006.01); B32B 27/04 (2006.01); B32B 27/18 (2006.01); B32B 27/38 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); B32B 17/04 (2006.01); H05K 1/03 (2006.01); B32B 27/26 (2006.01); B32B 17/10 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08G 59/30 (2013.01); B32B 15/14 (2013.01); B32B 27/04 (2013.01); B32B 27/18 (2013.01); B32B 27/38 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 1/0373 (2013.01); B32B 17/04 (2013.01); B32B 17/10733 (2013.01); B32B 27/26 (2013.01); C08G 59/308 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2463/02 (2013.01); C08K 3/36 (2013.01); C08K 2201/019 (2013.01); C08L 2205/16 (2013.01); C08L 2666/58 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0239 (2013.01); H05K 2201/0275 (2013.01); Y10T 428/259 (2015.01); Y10T 428/2971 (2015.01); Y10T 428/31529 (2015.04);
Abstract
Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In farther embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).
Chung, Chien-Jen. (2015). Epoxy resin varnishes, laminates and printed circuit boards (U.S. Patent No. 9169346). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9169346
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile