The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Jun. 12, 2013
Applicants:

Johannes Classen, Reutlingen, DE;

Paul Farber, Budapest, HU;

Inventors:

Johannes Classen, Reutlingen, DE;

Paul Farber, Budapest, HU;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 3/00 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0018 (2013.01); B81C 1/00238 (2013.01); B81C 1/00246 (2013.01); B81C 1/00261 (2013.01); B81C 2203/0735 (2013.01); B81C 2203/0771 (2013.01); B81C 2203/0785 (2013.01);
Abstract

An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area.


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