The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Oct. 14, 2011
Applicant:

Yuji Hamaguchi, Atsugi, JP;

Inventor:

Yuji Hamaguchi, Atsugi, JP;

Assignee:

NISSAN MOTOR CO., LTD., Yokohama-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/06 (2014.01); B23K 26/14 (2014.01); H01M 2/30 (2006.01); B23K 26/40 (2014.01); H01M 10/04 (2006.01); B23K 26/04 (2014.01); B23K 26/38 (2014.01); H01M 10/058 (2010.01);
U.S. Cl.
CPC ...
B23K 26/06 (2013.01); B23K 26/046 (2013.01); B23K 26/14 (2013.01); B23K 26/1476 (2013.01); B23K 26/4085 (2013.01); H01M 2/30 (2013.01); H01M 10/04 (2013.01); B23K 26/0639 (2013.01); B23K 26/381 (2013.01); H01M 10/058 (2013.01);
Abstract

The laser cutting method for cutting a pair of plate materials, each of which has a different thickness and melting point, by irradiating them with a laser is provided with a plate material placement process for placing the pair of plate materials side by side so that, out of the pair of plate materials, an opposite surface of a laser irradiated surface of a plate material with a lower melting point protrudes more than an opposite surface of a laser irradiated surface of a plate material with a higher melting point, a focus adjustment process for aligning a focus position of the laser with an undersurface opposite the laser irradiated surface of the plate material with a higher melting point out of the pair of plate materials, and a plate material cutting process for cutting the pair of plate materials through irradiation with the laser according to a series of operations while sustaining a focus position of the laser to the pair of plate materials.


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