The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jul. 07, 2009
Yasuo Onodera, Tokyo, JP;
Takahiro Shiozawa, Tokyo, JP;
Tatsushi Sato, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A wire electric discharge machining apparatus that performs an electric discharge machining by applying a pulse voltage between a wire electrode () and a workpiece (), the wire electric discharge machining apparatus including, a machining speed detection unit () that detects relative machining speed of the workpiece () and the wire electrode (); a machining energy calculation unit () that calculates machining energy of a discharge pulse; a board thickness calculation unit () that calculates a board thickness of the workpiece () based on the machining speed detected by the machining speed detection unit () and the machining energy calculated by the machining energy calculation unit (); a stationary state determination unit () that determines whether the machining is in a stationary state from a machining state during the machining, after the machining condition is switched in accordance with a board thickness of the workpiece () calculated by the board thickness calculation unit (); and a machining condition switching unit () that switches the machining condition to a machining condition corresponding to a board thickness calculated by the board thickness calculation unit () when the stationary state determination unit () determines that the machining is in the stationary state and does not switch the machining condition to the machining condition corresponding to a calculated board thickness when the stationary state determination unit determines that the machining is not in the stationary state.