The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9168587 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 27, 2015

Filed:

Mar. 26, 2013
Applicant:

Yamagata University, Yamagata-shi, Yamagata, JP;

Inventor:

Masato Kurihara, Yamagata, JP;

Assignee:

YAMAGATA UNIVERSITY, Yamagata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/20 (2006.01); B22F 9/30 (2006.01); B22F 1/00 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B22F 9/20 (2013.01); B22F 1/0018 (2013.01); B22F 1/0022 (2013.01); B22F 1/0062 (2013.01); B22F 9/30 (2013.01); B82Y 30/00 (2013.01);
Abstract

Provided are fine coated copper particles, which are fine with a narrow particle size distribution and superior storability, and which can be sintered at low temperatures. Specifically provided is a method for producing fine coated copper particles which is characterized by including: a step of mixing a copper-containing compound and a reducing compound to form a composite compound that is capable of thermal decomposition to generate copper in an alkylamine; and a step of heating the composite compound in the alkylamine to produce fine copper particles coated with the alkylamine.


Find Patent Forward Citations

Kurihara, Masato. (2015). Fine coated copper particles and method for producing same (U.S. Patent No. 9168587). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9168587

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