The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9167722 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 20, 2015

Filed:

Mar. 02, 2011
Applicant:

Hideo Nagasawa, Kanagawa, JP;

Inventor:

Hideo Nagasawa, Kanagawa, JP;

Assignee:

Molex Incorporated, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0275 (2013.01); G06F 1/20 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.


Find Patent Forward Citations

Nagasawa, Hideo. (2015). Electronic device provided with socket for card-shaped component (U.S. Patent No. 9167722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9167722

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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