The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jun. 30, 2011
Kenji Konda, Nagoya, JP;
Tomohisa Kurita, Nagoya, JP;
Hiroki Kitano, Nagoya, JP;
Tatsuya Nakamura, Nagoya, JP;
Hideo Yumi, Nagoya, JP;
Kenji Konda, Nagoya, JP;
Tomohisa Kurita, Nagoya, JP;
Hiroki Kitano, Nagoya, JP;
Tatsuya Nakamura, Nagoya, JP;
Hideo Yumi, Nagoya, JP;
Kitagawa Industries Co., Ltd., Inazawa-shi, Aichi, JP;
Abstract
A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.