The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Aug. 09, 2013
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Hiroshi Nakamura, Tokyo, JP;
Tomohiro Igarashi, Tokyo, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/50 (2006.01); H03H 7/46 (2006.01); H04L 5/14 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01); H04B 1/00 (2006.01); H03H 9/05 (2006.01); H03H 9/08 (2006.01);
U.S. Cl.
CPC ...
H04L 5/1461 (2013.01); H01L 23/3735 (2013.01); H04B 1/0057 (2013.01); H05K 1/0207 (2013.01); H05K 1/0216 (2013.01); H05K 1/0237 (2013.01); H01L 2224/16225 (2013.01); H03H 7/463 (2013.01); H03H 9/0547 (2013.01); H03H 9/08 (2013.01);
Abstract
Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFIC that performs transmission and reception processes for high-frequency signals, a power amplifier IC that amplifies a transmission signal from the RFIC, and a duplexer that separates a transmission signal outputted from the power amplifier IC to an antenna and a reception signal that is inputted from the antenna to the RFIC are formed on the top surface thereof. The duplexer is disposed between the RFIC and the power amplifier IC.