The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Oct. 14, 2013
Applicant:

Mnemonics, Inc., Melbourne, FL (US);

Inventors:

Fred Johnson, Pleasanton, CA (US);

Madjid A Belkerdid, Casselberry, FL (US);

Michael Keefe, West Melbourne, FL (US);

Assignee:

Mnemonics, Inc., Melbourne, FL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H01L 23/053 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02992 (2013.01); H03H 9/02897 (2013.01); H03H 9/059 (2013.01); H03H 9/1078 (2013.01); H01L 23/053 (2013.01); H01L 23/562 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized substrate with a space sufficient to allow the propagation of the SAW on a top surface of the substrate. The two substrates have similar thermal expansion coefficients such that stress from the sealing process is minimized. The two substrates are sealed using either a low melting point glass or an organic compound such that conductive pathways exist through the seal allowing the internal device to access an external electrical connection.


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