The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jun. 26, 2014
Denso Corporation, Kariya, Aichi-pref., JP;
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Yuuki Mikami, Kariya, JP;
Toru Itabashi, Anjo, JP;
Takahiko Furuta, Kasugai, JP;
Ryoichi Shiraishi, Obu, JP;
Hiroaki Nakamura, Nagaokakyo, JP;
Shigeki Nishiyama, Nagaokakyo, JP;
DENSO CORPORATION, Kariya, JP;
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, JP;
Abstract
An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.