The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jul. 11, 2013
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Koh Hashimoto, Yokohama, JP;
Yukako Tsutsumi, Kawasaki, JP;
Takayoshi Ito, Yokohama, JP;
Koji Akita, Yokohama, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01Q 13/10 (2006.01); H01Q 1/22 (2006.01); H01Q 1/44 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/10 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/44 (2013.01);
Abstract
According to one embodiment, a wireless device includes a circuit board, a semiconductor chip, a nonconductive layer, and a conductive film. The semiconductor chip includes a transmitting/receiving circuit and is mounted on the circuit board. The nonconductive layer is to seal the semiconductor chip. The conductive film is to cover a surface of the nonconductive layer, the conductive film being provided with a plurality of apertures serving as radiating elements. At least one aperture of the plurality of apertures is fed with power.