The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Jul. 03, 2014
Applicants:

Jtekt Corporation, Osaka-shi, Osaka, JP;

Denso Corporation, Kariya-shi, Aichi-ken, JP;

Inventors:

Shigeki Nagase, Nabari, JP;

Kazuo Tada, Anjo, JP;

Assignees:

JTEKT Corporation, Osaka, JP;

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 23/48 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 27/088 (2013.01); H01L 23/5389 (2013.01); H01L 25/074 (2013.01);
Abstract

In a semiconductor device, each of a first connection metal member, a second connection metal member, a third connection metal member, and a fourth connection metal member electrically connects a corresponding line to a corresponding one of main electrodes formed on lower surfaces and upper surfaces of first and second semiconductor elements. A cross-sectional area of each of the first connection metal member, the second connection metal member, the third connection metal member, and the fourth connection metal member is larger than a cross-sectional area of a fifth connection metal member that is disposed at a region located outside regions of the first and second semiconductor elements in a plan view.


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