The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Nov. 19, 2013
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Cheol Ho Joh, Icheon-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
The disclosure relates to a stacked package and a method for manufacturing the same. The stacked package includes: a lower package including a substrate formed with ball lands in a periphery of an upper surface thereof, a semiconductor chip mounted over the upper surface, first solder balls formed over the ball lands and each having a side surface cut along an edge of the substrate and a polished upper surface, and a mold part for molding the upper surface including the semiconductor chip and the first solder balls, the cutted side surfaces and polished upper surfaces being exposed by the mold part; and an upper package stacked over the lower package and provided with second solder balls bonded to the first solder balls.