The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Sep. 16, 2013
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
In Lee, Hwaseong-si, KR;
Abstract
A semiconductor package includes one or more semiconductor stack structures mounted on a package board. The semiconductor stack structures include sequentially stacked first to fourth semiconductor devices. Each of the first to fourth semiconductor devices includes a first unit semiconductor chip and a second unit semiconductor chip. The first unit semiconductor chip and the second unit semiconductor chip are unitary. A method for fabricating the semiconductor package includes forming pairs of unit semiconductor chips on a wafer, forming a scribe lane between the pairs of unit semiconductor chips, separating the pairs of unit semiconductor chips into semiconductor devices, each of the semiconductor devices having a corresponding one pair of unit semiconductor chips.