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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9165872 B1

PDFFull Text
Date of Patent:
Oct. 20, 2015

Filed:

Oct. 24, 2014

Chip scale diode package no containing outer lead pins and process for producing the same

Applicant:

Sfi Electronics Technology Inc., Taoyuan County, TW;

Inventors:

Ching-Hohn Lien, Taoyuan County, TW;

Xing-Xiang Huang, Taoyuan County, TW;

Hsing-Tsai Huang, Taoyuan County, TW;

Hong-Zong Xu, Taoyuan County, TW;

Assignee:

SFI ELECTRONICS TECHNOLOGY INC., Taoyuan County, TW;

Attorney:

Bacon & Thomas, PLLC

Primary Examiner:

A Sefer

Assistant Examiner:

Dilinh Nguyen

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/28 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 24/27 (2013.01); H01L 24/33 (2013.01); H01L 24/83 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/3107 (2013.01); H01L 23/49555 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12035 (2013.01);
Abstract

A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.

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