The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Nov. 13, 2013
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventor:
Toshiyuki Miyanagi, Azumino, JP;
Assignee:
FUJI ELECTRIC CO., LTD., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 25/03 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/492 (2013.01); H01L 23/49811 (2013.01); H01L 24/73 (2013.01); H01L 25/03 (2013.01); H01L 25/072 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01);
Abstract
In some aspects of the invention, semiconductor unit can produce chips performing uniform parallel operation and a low-thermal-resistance. Aspects of the invention can include a plurality of small semiconductor chips of one and the same kind formed by use of an SiC substrate, which is a wide gap substrate are sandwiched between two conductive plates. In this manner, there can be provided a high-reliability semiconductor unit in which parallel operation of the semiconductor chips is uniformized so that breakdown caused by current concentration can be prevented.