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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9165858 B1

PDFFull Text
Expired
Date of Patent:
Oct. 20, 2015

Filed:

Apr. 17, 2013

Liquid-cooled arrangement having modular power semiconductor modules and at least one capacitor device, and power semiconductor module therefor

Applicants:

Jürgen Steger, Hiltpolstein, DE;

Markus Knebel, Tuchenbach, DE;

Andreas Maul, Nürnberg, DE;

Susanne Kalla, Ebermannsdorf, DE;

Inventors:

Jürgen Steger, Hiltpolstein, DE;

Markus Knebel, Tuchenbach, DE;

Andreas Maul, Nürnberg, DE;

Susanne Kalla, Ebermannsdorf, DE;

Assignee:

Semikron Elektronik GmbH & Co., KG, Nürnberg, DE;

Attorney:

The Law Offices of Roger S. Thomson

Primary Examiner:

Courtney Smith

Assistant Examiner:

Zhengfu Feng

Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); H01L 23/34 (2006.01); F25B 21/02 (2006.01); H05K 1/00 (2006.01); H01R 13/46 (2006.01); H01L 23/473 (2006.01); H01H 9/52 (2006.01); H01L 23/06 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01H 9/52 (2013.01); H01L 23/06 (2013.01); H01L 25/074 (2013.01); H01L 25/117 (2013.01); H05K 7/20 (2013.01); H05K 7/20927 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An arrangement having a cooling circulation, a plurality of modular power semiconductor modules and at least one capacitor, wherein a power semiconductor module has a power electronics switch and a cooling device, which is capable of carrying a flow of a cooling fluid, for cooling the switch, the cooling device having at least one cooling face, and four connection devices for the cooling fluid. The connection devices are arranged in pairs on main sides of the power semiconductor module. The power semiconductor modules have their main sides strung together modularly by connecting corresponding connection devices on successive power semiconductor modules. To this end, at least two successive power semiconductor modules have a capacitor arranged between them which, for its part, is cooled by means of the cooling circulation of the cooling fluid as provided by the arrangement.

Find Patent Forward Citations

Steger, Jürgen. (2015). Liquid-cooled arrangement having modular power semiconductor modules and at least one capacitor device, and power semiconductor module therefor (U.S. Patent No. 9165858). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9165858

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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