The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Sep. 05, 2013
Lsis Co., Ltd., Anyang-si, Gyeonggi-do, KR;
Bohyun Youn, Seoul, KR;
Min Heo, Seoul, KR;
LSIS Co., Ltd., Anyang-Si, Gyeonggi-Do, KR;
Abstract
Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on the PCB, a connection member disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.