The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jul. 02, 2014
Applicants:
Kai Yun Yow, Petaling Jaya, MY;
Poh Leng Eu, Petaling Jaya, MY;
Inventors:
Kai Yun Yow, Petaling Jaya, MY;
Poh Leng Eu, Petaling Jaya, MY;
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/8389 (2013.01); H01L 2924/14 (2013.01);
Abstract
A packaged semiconductor device has an integrated circuit (IC) die and a heat spreader. The heat spreader has a first portion with holes formed entirely therethrough. The first portion is attached to the die using thermally-conductive adhesive that fills the holes. The holes enable the heat spreader to be attached to the die without placing excess pressure on the IC die that could cause the die to crack.