Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features

Abstract

Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (ρ), and specific heat (C) such that the product of k*ρ*Cresults in a value less than a product of k*ρ*Cfor human skin.