The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Oct. 25, 2011
Applicants:

Hidefumi Hatanaka, Kirishima, JP;

Katsura Hayashi, Kirishima, JP;

Inventors:

Hidefumi Hatanaka, Kirishima, JP;

Katsura Hayashi, Kirishima, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H03H 9/1007 (2013.01); H03H 9/1078 (2013.01); H03H 9/1085 (2013.01); H05K 1/181 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/09701 (2013.01);
Abstract

An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device () is provided with: a chip component () having an electronic element (); a wiring board () on which the chip component () is mounted with a space therebetween, the space for containing the electronic element (); a resin layer () provided from the surface of the chip component () to the surface of the wiring board () so as to surround the space; and an inorganic insulating layer (), which is provided at the resin layer () and is positioned at the side of the space. Since entry of water vapor into the space can be reduced not only by means of the resin layer () but also by means of the inorganic insulating layer (), the electronic device () having high airtight sealing performance can be provided.


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