The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Mar. 16, 2012
Applicants:

Heribert Zull, Regensburg, DE;

Korbinian Perzlmaier, Regensburg, DE;

Andreas Ploessl, Regensburg, DE;

Thomas Veit, Mintraching, DE;

Mathias Kaempf, Burglengenfeld, DE;

Jens Dennemarck, Regensburg, DE;

Bernd Boehm, Obertraubling, DE;

Inventors:

Heribert Zull, Regensburg, DE;

Korbinian Perzlmaier, Regensburg, DE;

Andreas Ploessl, Regensburg, DE;

Thomas Veit, Mintraching, DE;

Mathias Kaempf, Burglengenfeld, DE;

Jens Dennemarck, Regensburg, DE;

Bernd Boehm, Obertraubling, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/784 (2006.01); H01L 21/782 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 21/782 (2013.01); H01L 21/784 (2013.01); H01L 21/7806 (2013.01); H01L 31/18 (2013.01); H01L 33/0095 (2013.01); H01L 33/0079 (2013.01); H01S 5/0201 (2013.01);
Abstract

A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.


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