The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

May. 09, 2013
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Yousuke Hoshi, Tsukuba, JP;

Daisuke Ryuzaki, Kodaira, JP;

Naoyuki Koyama, Tsukuba, JP;

Shigeru Nobe, Hitachi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/306 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01); C09K 3/1463 (2013.01); H01L 21/31053 (2013.01);
Abstract

Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent.


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