The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
May. 24, 2012
Makoto Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Atsuko Saito, Nagaokakyo, JP;
Kenji Masuko, Nagaokakyo, JP;
Toshinobu Fujiwara, Nagaokakyo, JP;
Makoto Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Atsuko Saito, Nagaokakyo, JP;
Kenji Masuko, Nagaokakyo, JP;
Toshinobu Fujiwara, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.