The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Jun. 26, 2012
Applicants:

Dae Ki Lim, Gyunggi-do, KR;

Tae Sung Kim, Gyunggi-do, KR;

Hyeon Gil Nam, Gyunggi-do, KR;

Chan Gwang an, Gyunggi-do, KR;

Hyun Seok Lee, Gyunggi-do, KR;

Ki Won Chang, Gyunggi-do, KR;

Chang Mok Han, Gyunggi-do, KR;

Sang Woo Bae, Gyunggi-do, KR;

Sung Eun Cho, Gyunggi-do, KR;

Jae Suk Sung, Gyunggi-do, KR;

Inventors:

Dae Ki Lim, Gyunggi-do, KR;

Tae Sung Kim, Gyunggi-do, KR;

Hyeon Gil Nam, Gyunggi-do, KR;

Chan Gwang An, Gyunggi-do, KR;

Hyun Seok Lee, Gyunggi-do, KR;

Ki Won Chang, Gyunggi-do, KR;

Chang Mok Han, Gyunggi-do, KR;

Sang Woo Bae, Gyunggi-do, KR;

Sung Eun Cho, Gyunggi-do, KR;

Jae Suk Sung, Gyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 38/14 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H02J 7/02 (2006.01);
U.S. Cl.
CPC ...
H01F 38/14 (2013.01); H01F 27/2804 (2013.01); H01F 17/00 (2013.01); H01F 17/0006 (2013.01); H01F 27/29 (2013.01); H01F 2017/004 (2013.01); H01F 2017/0053 (2013.01); H01F 2017/0073 (2013.01); H01F 2017/0086 (2013.01); H02J 7/025 (2013.01);
Abstract

A thin film coil and an electronic device having the same. The thin film coil includes a substrate; and a coil pattern including a first coil strand and a second coil strand formed respectively on opposite surfaces of the substrate, wherein the first coil strand formed on one surface of the substrate includes at least one path that passes through the other surface of the substrate.


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