The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Aug. 25, 2014
Applicant:

Tpk Touch Solutions (Xiamen) Inc., Xiamen, CN;

Inventors:

Ching-Shan Lin, Tainan, TW;

Chunyan Wu, Sanming, CN;

Lianjie Ji, Xiamen, CN;

Fang Fang, Xiamen, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/047 (2006.01); B32B 37/24 (2006.01); B32B 43/00 (2006.01); G06F 1/16 (2006.01); H03K 17/96 (2006.01); B32B 33/00 (2006.01); B32B 37/00 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
G06F 3/047 (2013.01); B32B 33/00 (2013.01); B32B 37/24 (2013.01); B32B 43/006 (2013.01); G06F 1/1692 (2013.01); H03K 17/9618 (2013.01); B32B 37/025 (2013.01); B32B 38/0004 (2013.01); B32B 38/0008 (2013.01); B32B 38/0036 (2013.01); B32B 2037/243 (2013.01); B32B 2038/0076 (2013.01); B32B 2305/38 (2013.01); B32B 2307/202 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/208 (2013.01); Y10T 428/31507 (2015.04); Y10T 428/31544 (2015.04); Y10T 428/31721 (2015.04); Y10T 428/31786 (2015.04); Y10T 428/31931 (2015.04); Y10T 428/31935 (2015.04); Y10T 428/31938 (2015.04);
Abstract

A touch panel is formed by firstly forming a film layer on a first plate, and next, sequentially forming a buffer layer on the film layer, forming a sensing layer on the buffer layer, forming a second plate on the sensing layer. After the foregoing formation procedures, the first plate is removed from the film layer. Next, a cover is attached to the film layer. In this way, the film layer is located between the cover and the buffer layer. Finally, the second plate is removed from the sensing layer, so as to form a touch panel with the features of light weight, thin thickness and low costs.


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