The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Jun. 10, 2013
Applicants:

Sheng-yuan Hsu, Sugar Land, TX (US);

Kevin H. Searles, Kingwood, TX (US);

Eric R. Grueschow, Sugar Land, TX (US);

Tracy J. Moffett, Sugar Land, TX (US);

Inventors:

Sheng-Yuan Hsu, Sugar Land, TX (US);

Kevin H. Searles, Kingwood, TX (US);

Eric R. Grueschow, Sugar Land, TX (US);

Tracy J. Moffett, Sugar Land, TX (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06G 7/56 (2006.01); G06G 7/48 (2006.01); G06G 7/50 (2006.01); G01V 99/00 (2009.01); E21B 43/00 (2006.01); G06F 17/50 (2006.01); E21B 49/00 (2006.01); G01V 11/00 (2006.01);
U.S. Cl.
CPC ...
G01V 99/005 (2013.01); E21B 43/00 (2013.01); E21B 49/00 (2013.01); G01V 11/00 (2013.01); G06F 17/5009 (2013.01); G06F 17/5018 (2013.01); G06F 2217/16 (2013.01);
Abstract

A method for modeling deformation in subsurface strata, including defining physical boundaries for a geomechanical system. The method also includes acquiring one or more mechanical properties of the subsurface strata within the physical boundaries, and acquiring one or more thermal properties of the subsurface strata within the physical boundaries. The method also includes creating a computer-implemented finite element analysis program representing the geomechanical system and defining a plurality of nodes representing points in space, with each node being populated with at least one of each of the mechanical properties and the thermal properties. The program solves for in situ stress at selected nodes within the mesh.


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