The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Jul. 06, 2012
Jea-gun Park, Seongnam-si, KR;
Jin-hyung Park, Ulsan, KR;
Jae-hyung Lim, Seoul, KR;
Jong-young Cho, Seoul, KR;
Ho Choi, Seoul, KR;
Hee-sub Hwang, Seoul, KR;
Jea-Gun Park, Seongnam-si, KR;
Jin-Hyung Park, Ulsan, KR;
Jae-Hyung Lim, Seoul, KR;
Jong-Young Cho, Seoul, KR;
Ho Choi, Seoul, KR;
Hee-Sub Hwang, Seoul, KR;
INDUSTRIAL BANK OF KOREA, Seoul, KR;
Abstract
The present invention relates to a CMP slurry composition for polishing tungsten comprising a abrasive and a polishing chemical, wherein the abrasive comprises colloidal silica dispersed in ultra-pure water, and the polishing chemical comprises hydrogen peroxide, ammonium persulfate and iron nitrate. The slurry composition is not discolored and has good etching selectivity, so as to be applied to a CMP process.