The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Aug. 01, 2012
Mitsuru Koarai, Yamanashi, JP;
Mitsuru Koarai, Yamanashi, JP;
PIONEER CORPORATION, Kanagawa, JP;
PIONEER MICRO TECHNOLOGY CORPORATION, Yamanashi, JP;
Abstract
An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material M having fluidity, wherein the MEMS substrate has a bonding projection part provided to project from a substrate main body and having the bonding surface and a gap formation part disposed between the bonding projection part and the MEMS element, and the gap formation part is supported by the bonding projection part via a plurality of support pieces extending from the bonding projection part and forms reception gaps, which are capable of receiving the bonding material M extruded from the bonding surface to the side of the MEMS element, between the wall surface thereof and the bonding projection part.