The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2015
Filed:
Nov. 08, 2013
Jochen Zoellin, Muellheim, DE;
Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;
Christoph Schelling, Stuttgart, DE;
Juergen Graf, Stuttgart, DE;
Frederik Ante, Stuttgart, DE;
Michael Curcic, Stuttgart, DE;
Jochen Zoellin, Muellheim, DE;
Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;
Christoph Schelling, Stuttgart, DE;
Juergen Graf, Stuttgart, DE;
Frederik Ante, Stuttgart, DE;
Michael Curcic, Stuttgart, DE;
ROBERT BOSCH GMBH, Stuttgart, DE;
Abstract
A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical feedthrough is formed in the support which allows electrical contacting of the MEMS component through the support. To achieve the largest possible rear volume for the diaphragm structure of the MEMS component for a given chip surface area, and also to simplify the processing of the support, according to the invention the electrical feedthroughs are integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of such a feedthrough is implemented in the form of an electrically conductive coating of a side wall section of the cavity.