The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Feb. 08, 2013
Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Koichi Takemura, Shiga, JP;

Tomofusa Shibata, Kyoto, JP;

Yoshihisa Yamanaka, Shiga, JP;

Kazutaka Kaneko, Saitama, JP;

Yuzuru Fujie, Saitama, JP;

Naoki Hashimoto, Saitama, JP;

Taichi Suzuki, Shiga, JP;

Masayuki Kojima, Shiga, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); B29D 11/00 (2006.01); B29C 35/16 (2006.01); B29C 37/00 (2006.01); B29C 59/02 (2006.01); B29C 33/10 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00663 (2013.01); B29C 35/16 (2013.01); B29C 37/006 (2013.01); B29C 59/02 (2013.01); B29C 33/10 (2013.01); B29C 2035/1658 (2013.01);
Abstract

A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.


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