The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Mar. 24, 2014
Applicant:

Otto Manner Innovation Gmbh, Bahlingen, DE;

Inventors:

Swen Spuller, Forchheim, DE;

Gheorghe George Olaru, Freiburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/20 (2006.01); B29C 45/27 (2006.01); B29C 45/17 (2006.01);
U.S. Cl.
CPC ...
B29C 45/278 (2013.01); B29C 45/1734 (2013.01); B29C 45/1735 (2013.01); B29C 2045/2787 (2013.01); B29K 2995/0012 (2013.01); B29K 2995/0013 (2013.01);
Abstract

A hot runner nozzle assembly includes a nozzle heater, a hot runner nozzle, a nozzle tip, a nozzle tip seal surrounding the nozzle tip and a connecting element positioned to removably couple the tip seal to the nozzle tip and to create a first contact seal between the nozzle tip and the tip seal and a second annular contact seal between the tip seal and a mold component. The nozzle tip is made or shaped via a sintering process from a metal matrix composite (MMC) material having a first coefficient of thermal expansion. The tip seal is made or shaped from a ceramic based powder material, having a second coefficient of thermal expansion that is different from the first coefficient of thermal expansion. In operation this hot runner nozzle assembly provides an improved heat profile and a reduced leakage at the tip area under a wider operating processing window.


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